100G/200G ACC Cables

High-Throughput Links for Leaf-Spine & AI Racks

Overview

The NSComm 100G/200G Active Direct Attach Copper (ACC) family delivers high-speed, low-latency copper connectivity for modern data centers and AI/HPC environments. Using twinax copper with integrated QSFP connectors, ACC provides a plug-and-play alternative to optical transceivers and fiber patch cords-ideal for in-rack and adjacent-rack connections where cost, simplicity, and latency matter.

At 100G and 200G, ACC is commonly used to connect servers/GPU nodes to ToR (leaf) switches, and to build short-reach links inside leaf-spine fabrics. Breakout ACC cables also help you split higher-speed ports to match 50G/25G endpoints during upgrades.

Broad Compatibility (NVIDIA-First for 200G)

• 100G QSFP28 ACC models are available with multi-vendor coding options, making them suitable for diverse switch and NIC platforms.

• 200G QSFP56 ACC models are NVIDIA/Mellanox-focused for today's mainstream AI networking, while still supporting a generic option where needed.

If you're unsure which coding to choose, our engineers can confirm the right option for your switch/NIC/DPU models.

Product Range

This collection includes straight-through and breakout designs for practical deployment:

1. 100G QSFP28 ACC (up to 9m)

A standard choice for leaf-to-leaf, server-to-ToR, and short 100G switch interconnects.

2. 100G to 2×50G QSFP28 Breakout ACC (up to 9m)

Used to connect one 100G port to two 50G ports-great for phased upgrades and port efficiency.

3. 100G to 4×25G SFP28 Breakout ACC (up to 9m)

Ideal for breaking out one 100G QSFP28 into four 25G SFP28 links, commonly used for high-density server access.

4. 200G QSFP56 ACC (up to 7m) - NVIDIA/Mellanox Focus

Built for AI racks and next-gen fabrics where 200G is the building block for GPU clusters and high-throughput aggregation.

5. 200G to 2×100G QSFP56 Breakout ACC (up to 7m) - InfiniBand HDR Capable

Designed to split one 200G port into two 100G ports, often used to connect 200G switch ports to 100G nodes/NICs in AI/HPC environments.

Key Benefits

• Ultra-low latency: Direct electrical interconnect-excellent for AI/HPC east-west traffic.

• Cost-efficient: Avoids optics and reduces total BOM for short links.

• Clean & fast deployment: Pre-terminated assemblies reduce install time and error rate.

• Upgrade-friendly breakout options: Smooth migration between 25G/50G/100G/200G.

• AI-ready 200G: NVIDIA-focused options align with mainstream AI networking.

Buying Guide

• Choose the speed tier:

  • 100G for mainstream leaf-spine and server uplinks

  • 200G for AI pods and higher-throughput switch/NIC links

• Pick straight vs breakout:

  • Straight cables for simple QSFP-to-QSFP connections

  • Breakouts when you must connect one high-speed port to multiple lower-speed ports

• Match the topology:

  • Server/GPU → ToR (leaf) inside the same rack

  • Leaf ↔ leaf / leaf ↔ spine across adjacent racks

  • 200G switch → 2×100G NICs for AI/HPC builds

• Confirm coding early: especially for NVIDIA-based environments and mixed-vendor networks.

Conclusion

The 100G/200G Active Direct Attach Copper Cable Collection is built for high-density data centers and AI/HPC racks, combining low latency, cost efficiency, and practical breakout flexibility. Whether you're scaling a 100G leaf-spine fabric or deploying NVIDIA-centric 200G links, NSComm ACC cables deliver clean, reliable short-reach connectivity.

⚡ Build faster fabrics with NSComm 100G/200G ACC-made for leaf-spine and AI racks.